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[COE Seminar] 2022/11/29: "Low Temperature Inkjet Printing Ag Interconnect Technology for Flexible Microsystem Applications" - Yu-Ting CHENG, iE/NYCU

11110E500100 College of Engineering Seminar

TOPIC
▸ Low Temperature Inkjet Printing Ag Interconnect Technology for Flexible Microsystem Applications

Abstract
❝ Flexible microsystems have drawn lots of research attention recently due to great demands from personal portable devices. Several technologies have been developed for the realization of flexible microsystems. Nevertheless, inevitable high design and manufacturing complexity and process cost indicate more research effort is required in the development of flexible microsystem fabrication. In this talk, I will introduce an inkjet printing Ag interconnect technology for flexible microsystem applications. It is a platform technology to fabricate conductive interconnects with the characteristics of low-cost, low processing temperature, and size-scalable. Via printing and filling Ag nanoparticles in photopatterned molds, the technology can realize various microstructures including horizontal and vertical electrical interconnects, RLC passives, flexible biomedical sensors and actuators, etc. on a flexible substrate showing an alternative way to realize rapid and cost-effective on-site manufacture for IOT (Internet-of-Things) applications.
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SPEAKER
▸ Prof. Yu-Ting CHENG
▸ Institute of Electronics, National Yang Ming Chiao Tung University

HOST
▸ Prof. Sheng-Shian LI
▸ Institute of NanoEngineering & MicroSystem, National Tsing Hua University

TIME
▸ 2022/11/29 (TUE) 13:20 ~ 15:20

VENUE
▸ Auditorium Room 106, Engineering Building 1 

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