Congratulations to Prof. Chiang Kuo-Ning of the Department of Power Mechanical Engineering for being Appointed as an Honorary Chair of the 2024 International Microsystems, Packaging, Assembly and Circuits Technology Conference.
IMPACT: International Microsystems, Packaging, Assembly and Circuits Technology Conference.
IMPACT | Core Committee
https://www.impact.org.tw/site/mypage.aspx?pid=244&lang=en&sid=1283
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