Congratulations to Prof. Lee Chang-Chun of the Department of Power Mechanical Engineering for being Invited as the Guest Editor of the ASME Journal of Electronic Packaging.
Congratulations on Prof. Lee serving as the Guest Editor of ASME Journal of Electronic Packaging (JEP) for the Special Issue of “Reliability of 3D IC Packaging: Recent Progresses in Analysis, Simulation and Experimental Methodology”.
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