The new facility underscores a shared commitment to advancing materials characterization, semiconductor innovation, and talent development

The Department of Materials Science and Engineering, part of the College of Engineering at National Tsing Hua University (NTHU), recently marked a major infrastructure milestone with the official launch of a high-resolution transmission electron microscope (TEM) donated by Taiwan Semiconductor Manufacturing Company (TSMC).

The donated JEOL JEM-2100F field-emission TEM, equipped with a 200 kV field-emission gun, supports high-resolution imaging, selected-area electron diffraction analysis, scanning transmission electron microscopy, and energy-dispersive X-ray spectroscopy. These capabilities enable researchers to meticulously analyze crystal structures, interface characteristics, defect distributions, and elemental compositions. For materials scientists and semiconductor engineers, the power to observe materials at the nano- and atomic scales is crucial for understanding material properties, diagnosing device failures, and driving next-generation technological breakthroughs.

Beyond expanding analytical horizons, the new TEM facility substantially strengthens the Department’s research capacity across semiconductor materials, nanostructures, advanced packaging, electronic devices, and energy materials systems. By providing faculty and students with direct access to high-end analytical resources, the facility will deepen the Department’s expertise in high-resolution characterization capability—powering frontier research while delivering essential, hands-on training for the next generation of engineers.

This donation underscores a deep, long-standing partnership between TSMC and NTHU. Through strategic platforms like the TSMC–NTHU Joint Research Center (established in 2014) and the TSMC Program (launched in 2019), the Department of Materials Science and Engineering has aligned its expertise in materials analysis, development, and nanoscale characterization directly with industry needs. Over the years, this collaboration has fostered joint research, technical exchanges, specialized coursework, and internships—equipping students with both rigorous scientific depth and vital hands-on semiconductor experience.

Ultimately, the significance of this donation extends far beyond a simple hardware upgrade. It solidifies a shared platform that seamlessly bridges advanced materials science, semiconductor engineering, and industry practice. Furthermore, it underscores the Department's vital role in driving materials innovation and cultivating the elite engineering talent needed to power an increasingly interconnected global semiconductor ecosystem.